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产品展示

WBQFN

产品说明

Rick product:Large QFN, Small QFN, Flip Chip, Module

Multiple Chips + Components module
Bonding Wire 0.7~2.0mil Cu & Au wire
More Wire Counts: Die Overhang& >300 wire counts
Routable LF: Available for both wire bond & flip chip
Plating solder thickness:8~20um
Package size:2*2~12*12mm
Package thickness :0.31*3.95mm
 

产品详情


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